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5 & 6″ Wafer Containers

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For 5″ (125mm) Wafers Jars and Lids

Part Number             Description                                             Standard Package               
WMJ-1501 J, L 1-1/2″ Deep Wafer Jar and Lid 50 per case
WMJ-1502 J, L 3″ Deep Wafer Jar and Lid 50 per case

Foam Liner

ASL-2501P Anti-Static Foam Liner For 1501 Jar 50 per bundle
ASL-2502P Anti-Static Foam Liner For 1502 Jar 50 per bundle

Interleaf

HPD-3005 Filter Interleaf Disc 1000 per pak
TVK-3005 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2501P Anti-Static Foam Cushion 1000 per pak

For 6″ (150mm) Wafers Jars and Lids

Part Number Description Standard Package
WMJ-1601 J, L 1-1/2″ Deep Wafer Jar and Lid 50 per case
WMJ-1602 J, L 3″ Deep Wafer Jar and Lid 50 per case

Foam Liner

ASL-2601P Anti-Static Foam Liner For 1501 Jar 50 per bundle
ASL-2602P Anti-Static Foam Liner For 1502 Jar 50 per bundle

Interleaf

HPD-3006 Filter Interleaf Disc 1000 per pak
TVK-3006 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2601P Anti-Static Foam Cushion 1000 per pak
Containers feature a Snap-On lid

 

3 & 4″ Wafer Containers

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For 3″ (75mm) Wafers Jars and Lids

Part Number Description Standard Package
WMJ-1034 1-1/2″ Deep Wafer Jar 350 per case
WMJ-1038 3″ Deep Wafer Jar 200 per case
WML-1030 Lid for Wafer Jar 500 per case

Interleaf

HPD-3003 Filter Interleaf Disc 1000 per pak
TVK-3003 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2301P Anti-Static Foam Cushion 2000 per carton

For 4″ (100mm) Wafers Jars and Lids

Part Number           Description                          Standard Package          
WMJ-1412 1-1/2″ Deep Wafer Jar 120 per case
WMJ-1424 3″ Deep Wafer Jar 100 per case
WML-1400 Lid for Wafer Jar 150 per case

Interleaf

HPD-3004 Filter Interleaf Disc 1000 per pak
TVK-3004 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2401P Anti-Static Foam Cushion 2000 per carton
Containers feature a Screw-On lid

SPI/Semicon North America

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SPI/Semicon was formed in 1970 for the purpose of supplying products to the Semiconductor Industry.

We manufacture products for the semiconductor front-end (wafer fabrication) and back-end (finished devices). Our products are used to protect wafer and device damage during handling, testing, and shipping. We design and produce products to our specifications at manufacturing sites in Utah and Philippines. We utilize plastic injection molding, extrusion and vacuum-forming for manufacturing our products.

SPI/Semicon products are used to protect wafers and devices from damage during handling, testing and shipping, often from the US to many other countries. We design and produce products to our specifications and then warehouse the products for prompt customer delivery. We utilize many methods of manufacturing, such as extrusion, vacuum forming, injection molding and die cutting. We are proud of our unique designs and history of quality products.

On April 1, 1990, SPI/Semicon opened a new plant in Ogden, Utah. The factory is a equipped with the latest designs for producing shipping tubes for I.C.’s, with in-line printing and bow control. The factory also has injection molding presses, vacuum forming equipment and operates die cutting presses to produce custom parts and other company products, and utilizes computer assisted quality control.

SPI/Semicon prides itself on a philosophy of customer service. We listen to our customers’ problem , react by offering our appropriate existing products or creative new solutions. We endeavor to provide our customers with prompt, courteous service and quality products and fair prices.

 

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Corporate Headquarters

2670 South Commerce Way
Ogden, UT 84401
Tel: 801.399.5723
Fax: 801.393.7559
Toll Free: 1.888.295.5906

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