About

Our manufacturing facility in Ogden, Utah

SPI/Semicon was formed by combining two of the industry leaders in Semiconductor packaging, Semicon Systems and Semiconductor Products.  Semicon Systems began in 1970 making containers for transport and storage of silicon wafers, which was an emerging industry at the time.  Semiconductor Products was launched in 1987 as a division of Professional Plastics and competed head to head with Semicon Systems.  In 1995 Semicon Systems was purchased by Semiconductor Products and the current company was formed and named SPI/Semicon.  Professional Plastics is still the parent company of SPI/Semicon.

SPI/Semicon remains at the forefront of wafer transport and storage systems, but has expanded their semiconductor packaging offering to include a wide range of products beyond just wafer packaging.  Our Engineering Department has developed new products that protect items from the front end of wafer fabrication all the way to the very back end after a component has been produced until it is installed in a finished consumer product.

Our company’s capabilities have greatly expanded over the decades.  SPI/Semicon has a large state-of-the-art manufacturing facility in Ogden Utah.  Our “in-house” capabilities include injection molding, deep draw vacuum forming, and high speed in-line vacuum forming, die cutting, shape and tube extrusion, CNC machining, custom fabrication, assembly and testing.

SPI/Semicon expanded their worldwide presence to Asia in the year 2000 opening a fully integrated manufacturing facility in Cavite, Philippines.  Our Philippine operation has the same capabilities of our Utah facility, but with ten times the capacity of IC tube production.

Both of our manufacturing facilities are certified to ISO 9001 and our products are RoHs compliant.

SPI/Semicon has highly trained personnel in many countries to service our worldwide presence in the Semiconductor Industry.  And we have the ability to design products through our engineering group to meet the ever changing products that electronics manufacturers are creating.  We pride ourselves on our customer service, listening to our customers’ needs, then reacting quickly with solutions.

ISO 9008:2008

SPI/Semicon has received international recognition for the quality of its systems with the awarding of the prestigious ISO 9001:2008 certification. Under the requirements of the ISO 9008:2008 certification, an organisation needs to demonstrate its ability to consistently provide products or services and to enhance customer satisfaction in order to meet customer statutory and regulatory requirements.

We strive for excellence and receiving the ISO 9008:2008 certification is something we are very proud of as a company.

IC Shipping Tubes

IC Shipping Tubes

• Manufactured in our new Utah facility on state-of the-art equipment.
• Precision plastic profiles to your specifications.
• On-line printing and cut lengths controlled by microprocessors.
• All above profiles and many more are presently tooled and available for quick delivery.
• New or custom shaped will be quoted promptly

150 mm VWS WaferShipper

150 mm VWS WaferShipper™

Overview

The Texchem Advanced Products 150mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements.  The 150mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package.  By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.

The 150mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.

Features

• Package size and dimensions closely matches existing products that are widely used in the industry
• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Secure, easy to use assembly.
• Orientation features for proper cassette/base alignment
• Compatible with automated loading and unloading equipment
• Houses up to 25 Wafers
• Competitively Priced

Specifications

• L x W x H: 203mm x 164mm x 185mm
• Each package is double clean room bagged
• Part name: 150mm VWS
• Part number:  VWS150-A1

100 mm VWS WaferShipper

100 mm VWS WaferShipper™

Overview

The Texchem Advanced Products 100mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements.  The 100mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package.  By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.

The 100mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.

Features

• Package size and dimensions closely matches existing products that are widely used in the industry
• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Secure, easy to use assembly.
• Orientation features for proper cassette/base alignment
• Compatible with automated loading and unloading equipment
• Houses up to 25 Wafers
• Competitively Priced

Specifications

• L x W x H: 163mm x 146mm x 120mm
• Each package is double clean room bagged

* Part name: 100mm VWS

* Part number:  VWS100-A1

300 mm HWS-RM WaferShipper

300 mm HWS-RM WaferShipper™

Overview

The Texchem Advanced Products 300mm HWS-RM Horizontal WaferShiper™ is a unique design providing superior protection and substantial freight cost savings versus competitor HWS and FOSB models.  The 300mm HWS-RM is designed for transporting up to 25 thin to full thickness wafers using carbon loaded or non-woven interleaves.  By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.

All 300mm WaferShipper™ products are designed to meet SEMI Standard load port specifications to be compatible with automated wafer packing, unpacking, and sorting equipment.

Our unique, patent pending moveable wall design secures the wafers as the cover is closed. The edge-grip support “hugs” the wafers, limiting wafer movement and reducing particle generation. The WaferShipper™ provides unprecedented lateral shock protection by holding the entire stack of wafers radially, unlike competitor models which offer either no radial protection, or only hold the top several wafers. External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.

Features

• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Edge-grip support “hugs” the wafers, limiting wafer movement and reducing particulation
• Secure, easy to use four latch locking mechanism
• Arrowed, notch feature for proper top/base alignment
• Designed to meet SEMI Standards
• RF Tag Housing in the base for inventory and process management
• Compatible with automated packing/unpacking/sorting equipment
• Houses up to 25 Wafers using Carbon or Non-Woven Interleaves
• Houses up to 13 Bumped Wafers using Wafer Separator Rings (pn WSR300-R1)

Specifications

• L x W x H: 326mm x 326mm x 76mm
• Each package is double clean room bagged
• Part name: 300mm HWS-RM
• Part number: HWS-RM300-A1

200 mm HWS-RM WaferShipper

200 mm HWS-RM WaferShipper™

Overview

The Texchem Advanced Products 200mm HWS-RM Horizontal WaferShiper™ is a unique design providing superior protection versus competitor HWS models. The 200mm HWS-RM is designed for transporting up to 25 thin to full thickness wafers using carbon loaded or non-woven interleaves.  By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.

The 200mm HWS-RM WaferShipper™ is designed to closely match the exterior package size of existing products that are widely used in the industry and is compatible with most automated wafer packing, unpacking, and sorting equipment.

Our unique, patent pending moveable wall design secures the wafers as the cover is closed.  The edge-grip support “hugs” the wafers, limiting wafer movement and reducing particle generation. The WaferShipper™ provides unprecedented lateral shock protection by holding the entire stack of wafers radially, unlike competitor models which offer either no radial protection, or only hold the top several wafers. External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.

Features

• Package size and dimensions closely matches existing products that are widely used in the industry.
• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Edge-grip support “hugs” the wafers, limiting wafer movement and reducing particulation
• Unparalleled shipping and impact protection
• Secure, easy to use four latch locking mechanism
• Arrowed, notch feature for proper top/base alignment
• RF Tag Housing in the base for inventory and process management
• Compatible with most automated packing/unpacking/sorting equipment
• Houses up to 25 Wafers using Carbon or Non-Woven Interleaves
• Houses up to 13 Bumped Wafers using Wafer Separator Rings (pn WSR200-R1)

Specifications

• L x W x H: 226mm x 226mm x 69mm
• Internal Height:  31mm
• Each package is double clean room bagged
• Part name: 200mm HWS-RM
• Part number: HWS-RM200A2

Wafer Separator Rings

Overview

Texchem Advanced Products introduces the new 200mm and 300mm Wafer Separator Rings for use with our Bumped HWS (BHWS) and RM series of Horizontal WaferShippers^TM.  The WSR-R series Separator Rings are designed for transporting Bumped Wafers so that contact is only made within the SEMI Standard Exclusion Zone.   Extensive Finite Element Modeling and testing shows that our unique ring design offers superior wafer protection.

In certain cases, the customer may even elect to use our Wafer Separator Rings to eliminate the carbon or non-woven interleaves from their non-bumped wafers, so there is no contact with the finished circuitry on the wafers.  Now Texchem Advanced Products makes the decision yours.

The WSR-R series Rings can be used to transport up to 25 full thickness bumped wafers using our BHWS WaferShippers or 13 full thickness bumped wafers using our HWS-RM WaferShippers.  Either way, when these Wafer Separator Rings are used with our unique, patent pending moveable wall design the wafers will be securely held as the cover is closed.  The WaferShipper^TM provides unprecedented lateral shock absorption by holding an entire stack of wafers radially.  External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.

By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.

Features

• Designed specifically for use with our BHWS and HWS-RM Horizontal Wafer Shippers
• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Compatible with automated packing/unpacking/sorting equipment
• Up to 25 Wafers can be housed using our BHWS WaferShippers
• Up to 13 Bumped Wafers can be housed using our HWS-RM WaferShippers

Specifications:

Wafer Shipping Packing Instructions

Recommended packing method for SPI/Semicon wafer containers

Each wafer jar requires a foam liner, foam cushion discs, and wafer interleaf disc to effectively protect wafers during transport.

Follow these steps

1. Insert the Foam Liner around the inside wall of the wafer jar.
2. Place two Foam Cushion Discs in bottom of wafer jar.
3. Place Wafer Interleaf Disc on top of foam disc.
4. Place one wafer on top of Interleaf and continue putting an Interleaf Disc between each wafer as wafer jar is loaded.
5. Place Wafer Interleaf Disc on top of the last wafer loaded into jar.
6. Fill any empty space in top of jar with Foam Cushion Discs.

IMPORTANT NOTE: To prevent wafer breakage it is critical that the jar is “overfilled” by the thickness of the Foam Cushion Discs. This overfill creates a light compression on wafers when the lid is snapped onto the jar. The compression prevents wafer movement inside the jar which helps to prevent wafer damage. Please note – this “overfilling” procedure is to be used only with the soft foam cushions. When using firm foam in the container overfilling the container can cause breakage of the wafers. Over filling with firm foam can also cause the lid of the container not to seat properly and come off in transport.

The above instructions are intended for packing the 1-1/2″ deep wafer jar with up to 25 wafer. When packing 3″ deep jar with more than 25(up to 50) wafers place Foam Cushion Disc every five wafers.

Wafer Shipping Systems

Wafercon200

The SPI/Semicon Wafer Storage and Shipping Systems includes A Wafer Jar and Lid, Foam Liner, Foam Cushion Discs, and Wafer Interleaf Discs.

Wafer Jars and Lids

Jars and Lids are manufactured from virgin polypropylene resin-no fillers or additives. Material is chemically resistant and has high impact strength.

Foam Liners

Manufactured from 1.25 LB density pink polyurethane antistatic foam. This product is non-corrosive, has excellent cushion properties, and low particle generation. Surface Resistivity (ASTM D256) measures 10 Ohms/Sq. Meets MIL-B-81705 Static Decay Requirement (0% Cutoff) FTMS 101C, 4046 <2 Seconds.

Foam Cushion Discs

Produced from same materials as Foam Liners.

Wafer Interleaf Disc

Paper Disc: 100% Cellulose, Laboratory Grade Low-Lint Filter Paper. Low Sodium (169 PPM) and Sulfur (15-60 PPM) content.

Tyvek Discs: Spunbonded Olefin, tear proof non-particulating. Extremely low Sodium (1 PPM) and Sulfur (1 PPM) content. Special grade resists triboelectric charging.

Note: All of the above products are produced without CFCs or ODCs.