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Microwave Devices, Transducers

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Microwave Devices, Transducers

Microwave Devices Transducers

 

  • Individual device protection
  • Black conductive or clear antistatic PVC
  • Clear antistatic allows for easy identification
  • Reopens and closes without generating static charge
  • “LT” strip-pak supplied with either antistatic foam or conductive foam inserts
  • Part Numbers Add “C” For Conductive Add “A” For Antistatic
  • Clear impregnated static dissipative PVC or PETG.
  • Standard Thickness are .020″, .030″, .035″ and .050″
  • This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
  • decay at 12% relative humidity
  • Black conductive high impact polystyrene, standard thickness .020″ and .030″

 

 

Sizes Available
Part Number No. of Cavities Cavity Dimensions Typical Device
SP-ACR1LT 5 Pair 1.00 X 1.00 X .312 Microwave
SP-ACR2LT 5 Pair 1.187 X 1.00 X .12 Microwave
SP-ACR25T 25 Foam Fit Microwave
SP-AK101 5 Pairs 2.08 X 1.775 X .145 Microwave
SP-BIP2 10 Form Fit Transistor
SP-HY1 10 1.00 X 1.00 X .688 Accommodates Stud
SP-RF1LT 10 Forms Fits Multiple Devices Five Devices Shapes
SP-RF1LTA 10 Forms Fits Multiple Devices Five Devices Shapes
SP-RF2 10 Form Fit Microwave
SP-SCX1LT 10 1.312 X 1.125 X 1.00 Transducer
SP-TD1 10 .875 X .875 X.625 Transducer
SP-ODP-20 20 .780 X .530 X .700 Opto-Devices
SP-RF3 15 Form Fits Two Devices Microwave

TO Devices, Flatpack Substrates

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TO Devices, Flatpack Substrates

 

  • Individual device protection
  • Black conductive or clear antistatic PVC
  • Reopens and closes without generating static charge
  • “LT” strip-pak supplied with either antistatic foam or conductive foam inserts
  • Part Numbers Add “C” For Conductive Add “A” For Antistatic
  • Clear impregnated static dissipative PVC or PETG.
  • Standard Thickness are .020″, .030″, .035″ and .050″.
  • This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
  • decay at 12% relative humidity
  • Black conductive high impact polystyrene, standard thickness .020″ and .030″

 

 

Sizes Available
Part Number No. of Cavities Cavity Dimensions Typical Device
TR-FM15 Tray 15 .680 X .680 X .130 Substrates
TR-FPC1LT 10 1.25 X .688 X .156 Flat Pack
TR-FPC2LT 5 2.062 X 2.062 X.531 Flat Pack
TR-FP/SD1LT 10 .750 x 1.125 X .375 Flat Pack or DIP
GT-35 Tray 35 .760 X .340 X .060 Substrate
TR-38LT 10 Form Fit TO-3
TO-5A Tray 20 Long Lead40 Short Lead Form Fit TO-5
TO-5/18-LT 10 Individual Pack TO-5 and TO-8
TO8T Tray 10 .625 diameter TO-8 TO-8
TO8LT 10 Short Lead TO-8
TO8-2LT 10 Long Lead TO-8
TO18A Tray 10 Long Lead20 Short Lead Form Fit TO-18
TO66 25 Form Fit TO-18
HY3 3 4.500 X 1.875 X .625 Form Fit
FPC3 3 3.125 X 3.375 X .4375 Large Carrier

Dual-in-Line (DIP) Devices

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Dual-in-Line (DIP) Devices

  • Individual devices protection
  • Black conductive or clear antistatic PVC
  • Clear antistatic allows for easy identification
  • Reopens and closes without generating static charge
  • “LT” strip-pak supplied with either antistatic foam or conductive foam inserts
  • Part Numbers Add “C” For Conductive Add “A” For Antistatic
  • Clear impregnated static dissipative PVC or PETG.
  • Standard Thickness are .020″, .030″, .035″ and .050″
  • This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
  • decay at 12% relative humidity
  • Black conductive high impact polystyrene, standard thickness .020″ and .030″

 

 

Sizes Available
Part Number No. of Cavities Cavity Dimensions Typical Device
SP-CD1 3 Small Packages and 2 Large Packages Small: All .40 and .60LeadLage: All 90 Lead All Size DIPs
SP-FO1 10 2.0 X .938 X .250 Large DIPs
SP-FPSD1 LT 8 .75 X .53 X .50 DIPs or Flat Packs
SP-LD1 ALT 5 1.625 X .325 X .3125 16-28 Leads
SP-LD1 LT 5 2.125 X .688 X .280 16-40 Leads
SP-LD1 5 2.125 X .688 X .280 16-40 Lead
SP-LD2LT 4 3.30 X .950 X .375 40-64 Leads
SP-LD2 4 3.30 X .950 X .375 40-64 Leads
SP-LD2 5 DIPs .900 Wide
SP-LD2T
SP-LD3S 10 1.375 X .688 X .375Plus Heat Sink Large DIPsWith Heat Sink
SP-PB1LT 10 1.75 X 1.00 X .500 Piggyback DIPs
SP-PB3LT 10 2.00 X .75 X .625 Piggyback DIPs
SP-SD 1 10 1.188 X .375 X .280 Small DIP’s
SP-SD 1 LT 10 1.188 X .375 X .280 Small DIP’s
SP- LD 1 BLT 10 1.750 X .625 X .240 DIP with Piggyback Devices

Chip Carriers, PLCC-LCC

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Chip Carriers, PLCC-LCC

  • Individual device protection
  • Black conductive or clear antistatic PVC
  • Clear antistatic allows for easy identification
  • Reopens and closes without generating static charge
  • “LT” strip-pak supplied with either antistatic foam or conductive foam inserts
  • Part Numbers Add “C” For Conductive Add “A” For Antistatic
  • Clear impregnated static dissipative PVC or PETG.
  • Standard Thickness are .020″, .030″, .035″ and .050″
  • This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
  • decay at 12% relative humidity
  • Black conductive high impact polystyrene, standard thickness .020″ and .030″

 

 

Sizes Available
Part Number No. of Cavities Cavity Dimensions Typical Number of Lead
SP-CC1 LT 20 .385 X .390 X .050 20
SP-CC2 LT 20 .505 X .510 X .050 28
SP-CC3 LT 20 .650 X .675 X .050 44
SP-CC4 LT 10 .970 X .970 X .090 68
TR-CCT5 Tray 5 1.20 X .120 X .312 84
TR-CCT20 Tray 20 .85 X .52 X .312
TR-CCT25 Tray 25 .52 X .52 X .312 28
TR-CCT-LID
TR-FM15 Tray 15 .680 X .680 X .130
SP-GA2 LT 10 1.20 X 1.20 X .265 84
SP-RPS 1 Tray 25 1.20 X 1.20 X 375 84
SP-PLCC 1LT 15 .535 X .335.365 X .305 18R PLCC18R LCC
SP-PLCC 2LT 15 .380 X .380.358 X .358 20S PLCC20S LCC
SP-PLCC 3LT 10 .480 X .480.560 X .358 28S PLCC28R LCC
SP-PLCC 4LT 10 .595 X .495.560 X .458 32R PLCC32R LCC
SP-PLCC 5LT 10 .695 X .695.660 X .660 44S PLCC44S LCC
SP-PLCC 6LT 10 .790 X .790.760 X .760 52S PLCC52S LCC
SP-PLCC 7LT 10 1.00 X 1.00 68 PLCC

Pin Grid Array Devices

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Pin Grid Array Devices

 

  • Individual device protection
  • Black conductive or clear antistatic PVC
  • Clear antistatic allows for easy identification
  • Reopens and closes without generating static charge
  • “LT” strip-pak supplied with either antistatic foam or conductive foam inserts
  • “H”-style allows for heat sinks
  • Part Numbers Add “C” For Conductive Add “A” For Antistatic
  • Clear impregnated static dissipative PVC or PETG.
  • Standard Thickness are .020″, .030″, .035″ and .050″
  • This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
  • decay at 12% relative humidity
  • Black conductive high impact polystyrene, standard thickness .020″ and .030″

 

 

Sizes Available
Part Number No. of Cavities Cavity Dimensions
SP-BN1 LT 10 1.15 X 1.15 X .300
SP-BN1 7 1.15 X 1.15 X .300
SP-BN2 LT 10 1.40 X 1.40 X .250
SP-BN2 6 1.35 X 1.35 X .500
SP-BN2 S 5 1.50 X 1.50 X .340
SP-BN3 LT 10 1.25 X 1.25 X .500
SP-BN4 8 1.3125 X 1.3125 X .250
SP-BN4 6 1.55 X 1.55 X .500
SP-BN5 LT 7 1.5625 X 1.5625 X .250
SP-BN5 5 1.75 X 1.75 X .500
SP-BN6 7 1.562 X 1.5625 X .250
SP-GA1 LT 5 1.50 X 1.50 X .438
SP-GA2 LT 10 1.20 X 1.20 X .265
SP-GA3 LT 5 1.437 X 1.437 X .437
TR-HPS 1 Tray 25 1.2 X 1.2 X .375
TR-PGA15 Tray 15 1.62 X 1.62 X .400
TR-PGA20B Tray 20 1.690 X 1.690
TR-PGA25A Tray 25 1.324 X 1.325 X .360
TR-PGA25B Tray 25 1.325 X 1.325 x .360With Center Bump
TR-PGA30 Tray 30 1.400 X 1.400
TR-PGA30B Tray 30 1.575 X 1.575
TR-PGA36 Tray 36 .75 X .75 X .30
TR-PGA40 Tray 40 1.24 X 1.24
TR-PGA64 Tray 64 .75 X .75
TR-PGA80B Tray 80 .80 X .80
TR-PGA-LA (LID)

Fine Pitch Gull Wing Devices

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Fine Pitch Gull Wing Devices

  • Individual device protection
  • Black conductive or clear antistatic PVC
  • Clear antistatic allows for easy identification
  • Reopens and closes without generating static charge
  • EIA and EIAJ sizes
  • Gull wing leads “float” ensuring leading protection
  • Trays available with reinforced bottoms
  • Tray sizes 7.5 x 7.5 and 9 x 11
  • Part Numbers Add “C” For Conductive Add “A” For Antistatic
  • Clear impregnated static dissipative PVC or PETG.
  • Standard Thickness are .020″, .030″, .035″ and .050″
  • This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
  • decay at 12% relative humidity
  • Black conductive high impact polystyrene, standard thickness .020″ and .030″

 

 

Strip Pack Sizes Available
Part Number No. of Cavities Cavity Dimensions
SP-GW100 10 1.00 X .75
SP-GW132 15 1.20 X 1.20
SP-GW164 8 1.30 X 1.30
SP-GW32 10 .32 X .32
SP-GW39 10 .39 X .39
SP-GW51 10 .51 X .51
Tray Sizes Available
Part Number No. of Cavities Cavity Dimensions
GW15 LID
GW15T 15 .875 X .875
GW15B 15 .875 X 875
SP-GW100 25 .875 x .875
SP-GW132 15 1.20 X 1.20
SP-GW164 15 1.55 X 1.55
SP-G224 20 1.70 X 1.70
SP-GW39-51 (Cover) LID
SP-GW32 Bottom Works With GW39-51 Lid 10 .32 X .32
SP-GW39 Bottom Works With GW39-51 Lid 10 .39 X .39
SP-GW51 Bottom Works With GW39-51 Lid 10 .51 X .51

Device Trays

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  • Individual device protection
  • Black conductive or clear antistatic PVC
  • Trays stack for volume handling and shipping
  • Lids available for most trays
  • Part numbers: Add “C” For Conductive, Add “A” For Antistatic
  • Clear impregnated static dissipative PVC or PETG.
  • Standard Thickness are .020″, .030″, .035″ and .050″
  • This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
  • decay at 12% relative humidity
  • Black conductive high impact polystyrene, standard thickness .020″ and .030″

 

 

Sizes Available

Part Number No. of Cavities Cavity Dimensions Typical Device
TR-ACR25T 25 Form Fit Microwave
TR-CCT5 5 1.20 x 1.20 x .312 PLCC-LCC Chip Carrier
TR-CCT 20 20 .85 X .52 X .312 PLCC-LCC Chip Carrier
TR-CCT25 25 .52 X .52 X .312 PLCC-LCC Chip Carrier
TR-FM15 15 .680 x .680 x .130 Various
TR-FPC 100T 100 1.000 x .750 Flat Pack Carrier
TR-FPT 12C 12 2.250 x 2.260 Cerquad Flat Leads and Frame
TR-GW 15 Top/Bot. 15 .875 x .875 x .125 Fine Pitch Gull Wing
TR-GW 15B 15 .875 x .875 x .250 Fine Pitch Gull Wing with Bumpers
TR-HPS1 25 1.20 x 1.20 x .375 Pin Grid Array
TR-HPS2 15 1.10 X 2.20 X .375 Substrates
TR-HPS3 8 1.50 x 3.375 x .375 Substrates
TR-HPT25 25 1.56 X .890 X .180 Substrates
TR-HYB25 25 2.000 X 1.000 Large Hybrid Substrates
TR-HYT18 18 2.30 X .60 X .300 Substrates
TR-J44T 36 44 Lead Chip Carrier
TR-LF150T 150 Lead Frames
TR-LF150TA 150 Lead Frames
TR-MET1 60 1.00 x .562 x .125 Microwave
TR-PCC-20 20 1.775 x 1.775 124 Lead PLCC
TR-PGA-15 15 1.62 x 1.62 .400 Pin Grid Arrays
TR-PGA-15A 25 1.324 x 1.324 x .360 Pin Grid Arrays
TR-PGA25B 25 1.324 x 1.324 x .3660 Pin Grid Arrays with Center Bumps
TR-PGALID Pin Grid Arrays
TR-SCX16T 16 Form Fit Transducers
TR-SPX1T 20 Form Fit Transducers
TR-SS40T 40 Form Fit Substrates
TR-TO66 25 Form Fit TO-66
TR-TO220 60 Form Fit TO-220 Device
TR-WT 6 T 6 3.375 x 3.375 x 1875 3″ Wafers

 

 

 

 

150 mm VWS WaferShipper

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150 mm VWS WaferShipper™

Overview

The Texchem Advanced Products 150mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements.  The 150mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package.  By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.

The 150mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.

Features

  • Package size and dimensions closely matches existing products that are widely used in the industry
  • Manufactured with the industry’s cleanest, high-purity polypropylene material
  • Minimal outgassing, trace metals, and ionics
  • Unparalleled shipping and impact protection
  • Secure, easy to use assembly.
  • Orientation features for proper cassette/base alignment
  • Compatible with automated loading and unloading equipment
  • Houses up to 25 Wafers
  • Competitively Priced

 

Specifications

  • L x W x H: 203mm x 164mm x 185mm
  • Each package is double clean room bagged
  • Part name: 150mm VWS
  • Part number:  VWS150-A1

 

100 mm VWS WaferShipper

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100 mm VWS WaferShipper™

Overview

The Texchem Advanced Products 100mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements.  The 100mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package.  By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.

The 100mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.

Features

  • Package size and dimensions closely matches existing products that are widely used in the industry
  • Manufactured with the industry’s cleanest, high-purity polypropylene material
  • Minimal outgassing, trace metals, and ionics
  • Unparalleled shipping and impact protection
  • Secure, easy to use assembly.
  • Orientation features for proper cassette/base alignment
  • Compatible with automated loading and unloading equipment
  • Houses up to 25 Wafers
  • Competitively Priced

 

Specifications

  • L x W x H: 163mm x 146mm x 120mm
  • Each package is double clean room bagged

* Part name: 100mm VWS

* Part number:  VWS100-A1

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Corporate Headquarters

2670 South Commerce Way
Ogden, UT 84401
Tel: 801.399.5723
Fax: 801.393.7559
Toll Free: 1.888.295.5906

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